Features

Smooth & shinning surface
Low lead impurity
Good fluidity
Low generation of solder dross
High mechanical strength
Low aggressive to solder pot material
 

Alloy Code

Alloy Family

Features

G220
G214
G227P
G230P
G226
G235

Sn96.5Ag3Cu0.5
Sn97Ag3
Sn99.3Cu0.7P
Sn99.8Cu0.2P
Sn99.3Cu0.7Ni
Sn99.9Ni

Recommended for all wave soldering. Good solderability.
Top up alloy for G220 to reduce copper % when exeeding 0.75%.
Cost effective alloy but higher temperature & poor solderability.
Top up alloy for G227P to reduce copper % when exceeding 0.9%.
Good fluidity & low generation of solder dross.
Top up alloy for G226 to reduce copper % when exceeding 0.90%.

Recommended Setting

SnAgCu

SnCuP

SnCuNi

Soldering temperature (°C)
Soldering time (sec)
Pre-heat temperature (°C)

245-255
3-4
100-120

250-260
3-4
110-130

250-260
3-4
110-130

Standard Packaging
 

(a) Solder bar

500.0gm per bar
40 pieces of bar with 20.0kg per carton box

(b) Solid wire

20.0kg per high density of polyethylene bobbin

Copper Content In Lead Free Wave Soldering

Dissolution rate of copper content depends on

Solder temperature
Copper content in lead free alloys
Copper finishes on PCB

Contamination of copper above 1% has a potential to affect process and joint quality

Formation of Cu6Sn5 as solder dross
Transition from eutectic to pasty state

At 250°C temperature
Normal lead free alloys

G-Series alloys