|
|
|
THE G SERIES SOLDER PASTES ARE COMPOSED OF ULTRA FINE
SPHERICAL SOLDER POWDER WITH A VERY LOW OXIDE CONTENT AND A HIGHLY RELIABLE
FLUX
Features
- Excellent
continuous printability across various board designs
- Good
stencil life with consistent performance
- Good
solderability for difficult wetting requirements
- Low
and transparent flux residues
- Excellent
long term reliability performance
|
|
|
|
Standard Packaging
(a)
For Stencil printing application
|
(b)
For dispensing application
- 100gm syringe (100 pieces in 10.0kg per carton box)
- 750gm syringe (25 pieces in 18.75kg per carton box)
|
|
|
|
Code |
Composition |
Melting Range/°C |
Remarks |
|
Binary
|
|
G221 |
Sn96.5 Ag3.5 |
221(e) |
Simple binary alloy. Marginal wetting. |
|
G227 |
Sn99.3 Cu0.7 |
227(e) |
Inexpensive alloy but exhibit poor wetting. |
|
Ternary |
|
G220 |
Sn96.5 Ag3 Cu0.5 |
217-220 |
Predominant alloy for SMT assembly. |
|
G225 |
Sn95.5 Ag3.8 Cu0.7 |
217-221 |
Popular SAC alloy for American & European
SMT assembly . |
|
G213 |
Sn95.5 Ag4 Cu0.5 |
217-225 |
Expensive SAC alloy due to higher silver content |
|
G187 |
Sn64 Bi35 Ag1 |
139-187 |
Wide process window with good solderability |
|
Quartenary
|
|
G193 |
Sn93 Ag3.5 ln3 Bi0.5 |
202-214 |
Excellent solderability but expensive alloy
|
|
|
|
|
Parameter |
Value Range |
Remarks |
|
Viscosity |
150-250 |
JIS-Z-3284/IPC-TM-650 |
|
Flux content |
10.0-13.0 |
JIS-Z-3197/IPC-TM-650 |
|
Halogen content |
0.00-0.25 |
JIS-Z-3197/IPC-TM-650 |
|
Spread factor |
>90 |
JIS-Z-3197/IPC-TM-650 |
|
SIR (ohm) |
>1x1012 |
JIS-Z-3284/IPC-TM-650 |
|
Tackiness time |
>48 |
JIS-Z-3197/IPC-TM-650 |
|
|
Type of flux
RA,RMA, No Clean Low Residue
Solder powder size
From type 2 (45-75µm) to type 5 (25-15 µm)
|
|
|
|
|
|
|
|
|
QFP Placement
The placement of IC QFP is 100%
|
|
|
|
|
|
|
Before reflow
|
After reflow
|
No migration & corrosion |
Solder ball & flux spattering |
|
|
|
|
|
EVALUATION DATA OF LEAD FREE SOLDER PASTE XC-G220-05 (D56)
|
|
Continuous Printability Test
|
- Perform continuous printability test (24 hours) for 10
pieces
- Printing squeegee : Urethane, squeegee speed : 25mm/sec
|
|
Initial
|
After 24 hours
|
|
|
|
|
1st test piece |
10th test piece |
1st test piece |
10th test piece |
|
Observation
- Good continuous printing property
- Viscosity stable through time
|
|
|
|
|
Pre-heating And Reflow Test
|
- Pre-heating temperature at 150ºC for 120 seconds
- Reflow temperature at 245ºC for 30 seconds
|
|
Initial
|
After 24 hours
|
|
|
|
|
1st test piece |
10th test piece |
1st test piece |
10th test piece |
|
Observation
- Good solder appearance, no slumping, no slumping, no solder
bridging, no solder ball
- Low flux residues
|
|
|
|
|
