EXCELLENT SOLDERABILITY & NON SPATTERING

Features

• Excellent solderability properties
• Fast soldering with low fuming and low odor
• Low occurrences of spattering of flux and solder particles

Type  

Type of flux

Type of flux  
Halide content (%)
Spread factor (%)
SIR (ohm) 
Flux content (%)

RX-115A-1
0.45
>85
1x10¹¹
3.0-3.5  

RX-70
0.70
>85
1x10¹¹
3.5-3.5  

RX-90-RMA
0.03
>80
1x10¹²
3.0-3.5 

Alloy
Diameter (mm) 

G220, G226, G227, G232, G225, G290
0.25, 0.4, 0.5, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0 

Application of lead free hand soldering

• Solder tip temperature
• Dwell time
• Time to remove soldering iron
• Cleanliness of line

• Set hinger than SnPb at 350-370°C
• Set longer than SnPb
• Quicker than SnPb
• Remain clean and coated with alloy

Flux Spattering Test

To observe occurrence of flux spattering

• Iron tip temperature : 360°C
• Loading time : 1 sec
• Loading speed : 10mm/sec
• Diameter : 1.0mm

Spreading Test

To observe wetting spreadability on copper plate

• Hot plate temperature : 300°C
• Diameter : 1.0mm

XW-G220-D10 (RX-115A-1)

Other maker's products

XW-G220-D10 (RX-115A-1)

Other maker's products

Low occurence of spattering

Significant spattering

Spread factor > 85%
Less flux residues

Spread factor : -85%
More flux residues